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Socket for Memory Module Board
MCR89 Series
FEM Design Simulation
Designed in Miniature 2 Contacts with High Precision Spring
sFeatures
1. High Reliability
This socket achieves high reliability in the horizontal contact spring system.
4. Miniature Type and High Density Mounting
The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density.
2. Low Insertion Force
This socket prevents mis-insertion force in the preload structure.
5. Wide Effective Mounting Area
This socket is capable of widening the effective mounting area on the module printed board, and secures retention function by easy locking.
3. Easy Pattern Design
The dip contact through-hole diameter is only O0.5, and simplifies the pattern design.
6. Easy Board Mounting
The fixing pins are arranged in the same alignment as the contact, so as to easily install the connector in the board.
7. Accessories
sProduct Specifications
Rating Item 1. Contact Resistance 1000M ohms min. 2. Withstanding voltage No flashover or insulation breakdown. 3. Insulation Resistance 20m ohms max. 4. Vibration No electrical discontinuity of 10 s or more Current rating: 0.5A
Dust covers and jigs to remove the board are available.
Operating Temperature Range: -30 to +85c (Note 1) Storage Temperature Range: -10 to +60c (Note 2) Storage Temperature Range: 40 to 70% (Note 2) Conditions 500A DC 500V DC / 1 minute 100mA Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions. 96 hours at temperature of 40c and humidity of 90% to 95% 5 cycles under following condition;
Voltage rating: 125V AC Operating Humidity Range: 40 to 80% Specification
5. Humidity (Steady state) Insulation Resistance:1000M ohms min.
6. Temperature Cycle No damage, cracks, or parts looseness. 7. Durability (Insertion/withdrawal) Contact resistance: 20m ohms max.
Temperature : -55: 30 minutes +5 to 35c: 5 minutes max. 85c 200 cycles : 30 minutes15- to 30c 5 minutes max.)
Manual soldering: 300c for 3 seconds 8. Resistance to Soldering heat No deformation of components affecting performance. Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
D2
sMaterial
Part Insulator Contact Lock pin Material PPS Contact area Beryllium copper Copper alloy Lead area Finish Color : Brown Selective gold plating Solder plating Solder plating ----------------------------Remarks UL94V-0
sOrdering Information
MCR89 - 130 D - 1.27 DSA
1 2 3 4 5 1 Series Name: MCR89 2 Number of Contacts: 130 3 D: Double row 4 Contacts Pitch: 1.27mm 5 Board installation type
DSA: Straight dip type, board thickness 1.6mm DSC: Straight dip type, board thickness 2.6mm
BMounting Dimensions
D3
sDip Straight Type
Unit: mm Part Number MCR89-130D-1.27DSA(01) MCR89-130D-1.27DSC(01) CL No. 548-0173-0-01 548-0185-9-01 Number of Contacts 130 A 2.8 3.8 B 2.3 3.4
Note: 25 pieces are packaged in one set for sale. The above table indicates a packaging of 25 pieces.
BPCB mounting pattern
D4
BRecommended Module Board Dimensions
sDust Cover
Part Number MCR89-130D-DC(01)
CL No. 548-0180-5-01
Material
ABS
Finish Black
Note: 100 pieces are packaged in one set for sale. The above table indicates a packaging of 100 pieces.
sModule Board Extraction Jig
Operating Instruction
Part Number
MCR89-130D-EJ
CL No.
548-0183-3
Material Polyamid resin
Finish Black
(1) Insert the jig protrusion in the board hole. Grasping the handle, pull the board up.
(2) By loosing force, the board is removed from the jig.
D5

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